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The principle of laser wire stripping machine and advantages
Updated:2011-06-18 08:27  Origin:laser cutting machine  Author:Han's Yueming Laser  Hist:

  

The principle of laser wire stripping machine and advantages

 Principle of laser wire stripping

 The effect of laser thermal decomposition or destruction of the molecular chain effect on the need to strip material for processing of materials, depending on the material properties of layers, you can choose two different types of laser processing on the wire.

 CO2 laser stripping machine can peel the outer layer and insulated inner layer of non-metallic; materials such as metal-wavelength laser absorption coefficient is low, so no damage to the metal layer.

 YAG laser wire stripping machine can peel the metal shield; non-metallic materials such as the wavelength of the laser absorption coefficient is low, it will not damage the internal insulation.

     Both sets have a combination of stripping solution: external insulated rubber layer and close to the wire core nylon insulation for wire stripping machine with a CO2 laser peel; metal shield with a YAG laser wire stripping machine stripping.

 The advantages of laser wire stripping machine

 No contact with the wire processing, no processing of stress, not tensile internal cores (tool required a fixed strip, pulling the other end by a tensile force to remove the outer layer of material, easily lead wire core snapped) .

 Stripper cleaner, no residual (the choice of wire layers of material to absorb a good material for laser cutting of the cord layer is almost no processing will not affect; CO2 laser will only work on non-metallic layer, YAG's laser only works on the metal layer)

 Operation easier (no need to consider when workers cut or traction over the General Assembly had caused internal wire core fracture and other factors, less demanding on the skills of workers; computer parametric control, product quality will not be workers' skills, emotional and other factors impact). Machining diameter can be more detailed, especially for digital products with the production of thin cable (1.0mm in diameter below the thin, fine coaxial cable or digital product using traditional tools such as hard machining; laser method is very suitable for small line processing).
 

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