IC Laser Decapsulation Machine Series
DM300-1C
- Laser power(w):5W/20W
Double CCD high-definition vision system, real-time monitoring, recording and analysis of the processing process, and processing parameters can be set according to different local areas and materials; High-quality professional light source, stable power output, no damage to the base material, to ensure that the bottom material is intact during the opening process;Self-developed professional laser control system and software system, equipped with high precision high-speed oscillator, automatic stop of dew gold during processing, can achieve different depths and thickness of the chip sealing applications;
Features
Integrated multi-functions into one, create more value for customer

Double CCD high-definition vision system, real-time monitoring, recording and analysis of the processing process, and processing parameters can be set according to different local areas and materials;

High-quality professional light source, stable power output, no damage to the base material, to ensure that the bottom material is intact during the opening process;

Self-developed professional laser control system and software system, equipped with high precision high-speed oscillator, automatic stop of dew gold during processing, can achieve different depths and thickness of the chip sealing applications;

Equipped with automatic lifting and focusing and precision fine-tuning loading platform, which is convenient for precision adjustment of workpiece position during processing and inspection;
Parameters
Optimization and innovation, make product faster, more stable and more assured.
| Model | DM300-IC | |||
|---|---|---|---|---|
| Working area | 50×50mm | |||
| Overall dimension | 900×600×820mm | |||
| Laser power | 5W/20W | |||
| CCD vision system | 50×50mm | |||
| Positioning accuracy | ±0.05mm | |||
| Visual Monitoring System | 100×100mm | |||
| Working environment | Temp:10~30°C Humidity:40%-75% Clean | |||
*The appearance, parameters, performance description, data, etc. of the products displayed on this page are all from the testing and experimentation of our company's own products in the internal laboratory of Dan's Yueming Laser Factory. They are for reference only, and the actual product shall prevail.
Application
Mainly used for chip,capacitor,resistor and other electronic components laser opening,cutting,thinning.
Product Video
Every detail strives for perfection, with humanized operation desks, all-round design, and stainless steel edging, to create industrial products with luxury requirements to meet your needs for product appearance and taste.
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